Valued Subscriber, Interface standards are driving new chiplet designs

Interface standards driving new chiplet designs

View web version 3 April 2024 — Issue 7 | Vol 19     Source Products  |  Webinar Library  |  Standards Interface standards driving new chiplet designs Chiplets are small dies connected on an IC substrate, but they also need a standard to allow electronic communication between components and subsystems. Read more → Mouser Electronics NXP Semiconductors MCX A series FRDM development boards Low-cost, compact and scalable boards for rapid prototyping using MCUXpresso to address applications with scalable device options, low power and intelligent peripherals.   View more Dataforth Corporation Signal conditioning for sensor applications Use this tutorial to plan your next sensing project. It covers all the classic concerns and environmental considerations; and offers a special section dedicated to sensing applications. Read the tutorial!   Learn more Reimagining PCB design: The advantages of a box-first approach The box-first approach shifts the paradigm to prioritize the enclosure at the very earliest stages of development, enabling engineers to unlock new efficiencies, streamline supply chain management and reduce overall costs. Read more → Where new semiconductor fabs are being built Companies are just now starting to get funding from the U.S. CHIPS and Science Act and European Chips Act (ECA). While both regions are expanding their fabrication capacity, these sectors are certainly not the only ones. Read more →

Master Bond, Inc. Thermally conductive, electrically non-conductive, low outgassing epoxy Master Bond EP40TC is an epoxy with notable bond strength, elongation and toughness. With small particle size filler, this epoxy can fill small cavities and be applied in thin sections.   View more ECS Inc. International What are temperature controlled oscillators (TCXOs)? Delve into the evolution of TCXOs, from traditional designs to ASIC TCXOs, exploring temperature compensation techniques and advancements in miniaturization and integration. Gain insights into future trends and market demands with this white paper.   Learn more TechInsights Teardown: Continental 3D flash lidar Lidar is at the core of technologies in relaying information to the core computer in vehicles so it can adjust in time. The Continental 3D flash lidar is built for internal use inside vehicles for both ADAS and eventually automated functions. Read more → A look at semiconductor manufacturing, testing and packaging The consumer electronics, appliances, electrical vehicles and internet of things (IoT) that help make modern life so much easier are all products of semiconductor manufacturing, an essential industrial process. Read more →

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