Valued Subscriber, Packaging is the next roadblock to passing 224G

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Packaging is the next roadblock to passing 224G

The next highest data rate might continue to implement PAM-4 modulation, but there are alternative options that could place more focus on things like equalization to ensure data can be recovered from these bitstreams. Read more →

Advanced Interconnections Corp.

Reduce PC board assembly time with Peel-A-Way® carriers

Peel-A-Way® removable, terminal carriers provide an economical method for automated pin and socket loading in PC boards and feature screw-machined terminals. Watch the video or order a sample to learn more.

Takachi Electronics Enclosure Co., Ltd.

IoT small plastic case

Small plastic case ideal for use as IoT devices.

Easy assembly, snap-in construction. Suitable for devices intending to be used under direct sunlight. Click here for further details!

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The significance of modular multilevel converters

This converter technology is of value because of the improvements in efficiency, harmonic distortion reduction, fault tolerance and scalability it provides. Read more →

Arduino launches 4 inch touchscreen

Called the GIGA Display Shield, the touchscreen allows users working with the GIGA R1 Wi-Fi to add an interface, high-level user experiences and technology to their projects. Read more →

Keystone Electronics Corp.

SMT and THM maxi "auto" blade fuse holders

Fully insulated, maxi automotive blade fuse holders accommodate MAXI 299, MAX, APX or equivalent fuses, support voltage up to 500 VAC; 40 amps current while ensuring secure positioning during soldering.

onsemi

Latest IGBTs and SiC for bidirectional inverters with coupled battery storage

Discover the latest IGBTs and SiC MOSFETs technologies for significant bidirectional capability performance improvements. Both transistors offer improved switching and reduced conduction losses over previous generations for higher efficiency designs.

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TechInsights Teardown: ASUS Zenbook 17 Fold notebook

The computer boasts a huge 17-inch organic light emitting diode (OLED) foldable display with touchscreen. The notebook is powered by the Intel 4.70 GHz deca-core application process and 8 GB SDRAM multichip memory. Read more →

CHIPS Act funding creates 8 innovation hubs

The Department of Defense (DoD) has awarded nearly $240 million through the CHIPS and Science Act to build eight microelectronics commons regional innovation hubs in the U.S. Read more →

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Science X Newsletter Mon, Apr 1

Dear manoj dole, Here is your customized Science X Newsletter for April 1, 2024: Technology news Using a 2D perovskite oxide as a photoactive high-κ gate dielectric Two-dimensional (2D) superconducting materials have been found to be promising for the development of miniaturized optoelectronic devices. To perform well while consuming less energy, however, these smaller devices require a higher gate capacitance (i.e., gates that can store more electrical charge in proportion to the voltage applied). An optimization-based method to enhance autonomous parking Vehicles that can drive themselves have been a long sought after goal both of robotics research and the automotive industry. While various companies have been investing in these vehicles and testing them, they have so far only deployed them in a limited number of settings. A...

Mechanic Consumer Electronic Appliances Skill

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